Interposer instrumentation method and apparatus

ABSTRACT

The disclosure describes a novel method and apparatus for improving interposers to include embedded monitoring instruments for real time monitoring digital signals, analog signals, voltage signals and temperature sensors located in the interposer. An embedded monitor trigger unit controls the starting and stopping of the real time monitoring operations. The embedded monitoring instruments are accessible via an 1149.1 TAP interface on the interposer.

This application is a divisional of prior application Ser. No.14/989,325, filed Jan. 6, 2016, currently pending;

Which was a divisional of prior application Ser. No. 14/505,948, filedOct. 3, 2014, now U.S. Pat. No. 9,261,558, issued Feb. 16, 2016;

Which was a divisional of prior application Ser. No. 13/447,465, filedApr. 16, 2012, now U.S. Pat. No. 8,880,968, issued Nov. 4, 2014;

Which claims priority from Provisional Application No. 61/479,189, filedApr. 26, 2011.

This disclosure relates generally to instrumentation circuits and inparticular to the implementation of instrumentation circuits withinsilicon interposers.

FIELD OF THE DISCLOSURE Background of the Disclosure

Integrated circuits (ICs) may be designed to include embeddedinstruments for monitoring activities and conditions within the IC.Access to embedded IC instruments is typically achieved via thededicated terminals of the IC's IEEE 1149.1 Test Access Port (TAP)interface.

FIG. 1 illustrates an example integrated circuit die 102 that includesfunctional circuits such as but not limited too, a microcontroller unit(MCU) 104 circuit core, a digital signal processor (DSP) 106 circuitcore, memory circuit cores 108 and other functional digital or analogcircuit cores 110. The IC's functional circuits are coupled together viaan internal functional input and/or output (FIO) bus 112 to allow themto communicate with each other. The IC has external FIO signal terminals114 to allow the functional circuits of IC 102 to communicate withfunctional circuits of other ICs.

FIG. 2 illustrates an example integrated circuit die that includes thefunctional circuits of die 102 plus the well known IEEE 1149.1 TAP 204,boundary register (BR) 206 and TAP input/output (TIO) interface 208. TheTIO interface 208 includes TDI, TCK, TMS input signals and a TDO outputsignal. The TAP 204 responds to the TCK and TMS signals to input datafrom TDI and output data to TDO. If the boundary register 206 isselected for access it will shift data from TDI to TDO. During normaloperation of the die 202, the boundary register couples the internal FIObus signals 112 to the external FIO signals 114 to allow the die tofunctionally operate with other die. During boundary scan test modeusing the well known 1149.1 Extest instruction, the boundary registerisolates the internal FIO buss signals 112 from the external FIO signals114. In the boundary scan Extest mode the boundary register can beoperated by the TAP to perform interconnect testing between the externalFIO signals 114 of die 202 and the FIO signals 114 of die connected todie 202.

FIG. 3 illustrates the TAP 204 of die 202 in more detail. The 1149.1 TAPincludes, at minimum, a TAP state machine (TSM) 302, an instructionregister 304, a Bypass Register 306, the Boundary Register 206 and a TDOoutput multiplexer circuitry 308. The TSM 304 operates according to thewell known 16 state transition diagram of FIG. 4 in response to the TCKand TMS input signals to; (1) place the TAP in a Test Logic Reset state,(2) place the TAP in a Run Test/Idle state, (3) perform a scan operationto the instruction register from TDI to TDO, (4) to perform a data scanoperation to the Bypass Register 308 from TDI to TDO or (4) perform adata scan operation to the Boundary Register 206 from TDI to TDO. The1149.1 interface may include an optional TRST input, shown in dottedline, to reset the TSM and other TAP circuits. If the TRST input is notincluded, a Power Up Reset (POR) circuit 310 may be used to reset theTSM and other TAP circuits.

During instruction scan operations, the TSM outputs control (CTL)signals to the instruction register 304 and multiplexer circuitry 308.In response to the CTL signals the instruction register performscapture, shift and update operations. During the shift operation theinstruction register shifts data from TDI to TDO via multiplexer 308.

During data scan operations, the TSM outputs CTL signals to the selecteddata register 306 or 206 and multiplexer 308. The instruction registeroutput (IRO) bus enables the selected data register and controlsmultiplexer 308 to couple the TDO output of the selected data registerto the TDO output of the die. In response to the CTL signals theselected data register performs capture, shift and update operations,except for the Bypass Register 306 which does not have update circuitry.During the shift operation the selected data register shifts data fromTDI to TDO via multiplexer 308.

FIG. 5 illustrates an example integrated circuit die 502 that includesthe functional circuits and IEEE 1149.1 TAP circuits of die 202 plusembedded instrumentation circuits 504. As seen, the embeddedinstrumentation circuits may exist as part of the functional circuits104-110 of the die or they may exist as separate circuits on the die. Inthis example, access to the instrumentation circuits is achieved via theTAP of die 502. The instrumentation circuits may provide any type ofoperations on the die, including but not limited too, test operations,debug operation, trace operations, temperature monitoring operations andvoltage monitoring operations.

FIG. 6 illustrates a first known example of how the TAP 204 may accessthe instruments 504 of die 502 of FIG. 5. In this example, eachinstrument 1-N is separately accessed between TDI and TDO by loading theTAP instruction register with an instruction that accesses a selectedone of the instruments 1-N.

FIG. 7 illustrates a second known example of how the TAP 204 may accessthe instruments 504 of die 502 of FIG. 5. In this example, allinstruments 1-N are accessed together in series between TDI and TDO byloading the TAP instruction register with an instruction that accessesall the serially connected instruments 1-N.

FIG. 8 illustrates a third known example of how the TAP 204 may accessthe instruments 504 of die 502 of FIG. 5. In this example, eachinstrument 1-N is interfaced to a segment insertion bit (SIB) 802-804that can select its associated instrument for access or deselect itsassociated instrument from access. All the SIBs are serially connectedtogether to form a data register. The SIB data register is selectedbetween TDI and TDO by an instruction loaded in the TAP instructionregister. When no instruments are selected the SIB data registerconsists only of a single bit for each SIB. For example if 5 SIBs existin the SIB data register, the length of the data register will be 5bits. When the bit of a SIB is loaded with a logic state for selectingits instrument, its instrument is included in the SIB data registerbetween TDI and TDO. For example, if the bit of SIB 802 is set to astate that selects its instrument (i.e. Instrument 1), the SIB dataregister between TDI and TDO will be lengthened to included the lengththe register within Instrument 1. Using the SIBs, any of the instruments1-N may be included into the SIB data register or excluded from the SIBdata register. This instrumentation access example is the subject of adeveloping IEEE instrumentation access standard P1681. The concept ofusing SIB-like circuits (DSMs) for varying the length of a serial scanpath was first described 1987 in U.S. Pat. No. 4,872,169.

FIG. 9 illustrates a device 902 comprising a stack of die 904-908mounted upon a silicon interposer 910. The interposer 910 is furthermounted to system substrate 912, such as, but not limited too, a smartphone printed circuit board (PCB), a PC PCB or another die. The die904-908 in this example are designed using through silicon vias (TSV)914. TSVs are connectivity paths formed between the top and bottomsurfaces of the die. TSVs allow substrate signals to flow vertically upand down the die stack via the interposer 912 to provide input to andoutput from the circuitry in each die. The die circuitry of this exampleonly contains functional circuitry as described in FIG. 1. Thus only FIOsignals pass between the substrate 912 and the stacked die 904-908. Thefunction of interposers is to spread connections from fine pitch contactpoints on one surface to wider pitch contact points on another surface.In this example, the fine pitch contact points on the bottom surface ofdie 904 are spread to match the wider pitch contacts points of thesystem substrate 912, via interposer 912.

FIG. 10 illustrates a device 1002 comprising a stack of die 1004-1008mounted upon a silicon interposer 1010. The interposer 1010 is furthermounted to system substrate 1012. As in the device 902 of FIG. 9, thedie 1004-1008 in this example are designed using TSVs 914. The diecircuitry of this example contains functional circuitry and TAPcircuitry as described in FIGS. 2-4. Thus both FIO and TIO signals passbetween the substrate 1012 and the stacked die 1004-1008. The TAPcircuitry may provide access to embedded instruments on the die asdescribed in FIGS. 5-8.

FIG. 11 illustrates a first method of providing the TIO (TCK, TMS, TDIand TDO) signals between the TAPs of die 1004-1008 and the substrate1012. In this example, the substrate provides a dedicated TCK, TMS, TDIand TDO signal interface to each die so that each die TAP can beaccessed separately. The problem with this method is that the substrateis required to include separate TIO busses for each die.

FIG. 12 illustrates a second method of providing the TIO signals betweenthe TAPs of die 1004-1008 and the substrate 1012. In this example, thesubstrate provides a common TCK, TDI and TDO signal connections to eachdie TAP and separate a TMS signal to each die TAP. This example iscommonly referred to as a STAR connection. To access the TAP of die1004, its TMS signal becomes active to shift data in and out via TDI andTDO. To access the TAP of die 1006, its TMS signal becomes active toshift data in and out via TDI and TDO. To access the TAP of die 1008,its TMS signal becomes active to shift data in and out via TDI and TDO.The problem with this method is that the substrate is required toinclude a separate TMS signal for each die.

FIG. 13 illustrates a third method of providing the TIO signals betweenthe TAPs of die 1004-1008 and the substrate 1012. In this example, thesubstrate provides common TCK and TMS signal connections to each dieTAP, a TDI connection to die 1004 and a TDO connection to die 1008. TheTDO signal of die 1004 is connected 1304 to the TDI signal of die 106and the TDO signal of die 106 is connected 1306 to the TDI signal of die1008. To access the serially connected TAPs of die 1004-108, the TCK andTMS signals become active to shift data into the serially connected dieTAPs from the substrates TDI input to the TDO output. The problem withaccessing device 1302 using this method is that serially connectingmultiple TAPs together in a device is not compliant with the IEEE 1149.1standard. IEEE 1149.1 expects a device to only have one instructionregister and one bypass register connected between the devices TDI andTDO terminals.

The following disclosure describes a new method of providinginstrumentation circuitry in devices that include stacked die mounted oninterposers.

BRIEF SUMMARY OF THE DISCLOSURE

This disclosure describes an interposer that is improved to includeinstrumentation and IEEE 1149.1 TAP circuitry. The instrumentationequipped interposer can be used in devices in place of conventionalinterposers.

BRIEF DESCRIPTION OF THE VIEWS OF THE DRAWINGS

FIG. 1 illustrates an integrated circuit die.

FIG. 2 illustrates an integrated circuit die with IEEE 1149.1 TAPcircuitry.

FIG. 3 illustrate an IEEE 1149.1 TAP.

FIG. 4 illustrates the operational state diagram of the TAP.

FIG. 5 illustrates a die containing a TAP and embedded instruments.

FIG. 6 illustrates a first TAP access method to instruments in a die.

FIG. 7 illustrates a second TAP access method to instruments in a die.

FIG. 8 illustrates a third TAP access method to instruments in a die.

FIG. 9 illustrates a substrate with functional inputs and outputsconnected to a stacked die via an interposer.

FIG. 10 illustrates a substrate with functional and test inputs andoutputs connected to a stacked die via an interposer.

FIG. 11 illustrates a first method of accessing TAPs in a stacked dievia an interposer.

FIG. 12 illustrates a second method of accessing TAPs in a stacked dievia an interposer.

FIG. 13 illustrates a third method of accessing TAPs in a stacked dievia an interposer.

FIG. 14 illustrates the interposer of the present disclosure locatedbetween a substrate and a die stack.

FIG. 15 illustrates the TAP access to instrumentation monitors includedin the interposer of FIG. 14.

FIG. 16 illustrates a more detail view of the TAP and instrumentationmonitors of FIG. 14.

FIG. 17 illustrates voltage, ground and functional input and/or outputsconnections of the interposer of the present disclosure.

FIG. 18 illustrates the trigger unit and monitors of the presentdisclosure coupled to address, data, control, VB, GB, analog signals andtemperature sensors within the interposer.

FIG. 19 illustrates the monitor trigger unit's plug-n-play control busto a number of monitors in an interposer.

FIG. 20A illustrates a first example implementation of the monitortrigger unit.

FIG. 20B illustrates a second example implementation of the monitortrigger unit.

FIG. 21 illustrates an example implementation of the programmabletrigger controller of the monitor trigger unit.

FIG. 22 illustrates an example implementation of the trigger controllerof the programmable trigger controller.

FIG. 23 illustrates the operation diagram of the state machine in thetrigger controller.

FIG. 24 illustrates an example timing diagram of the state machine inthe trigger controller.

FIG. 25 illustrates the general architecture of the monitors of thepresent disclosure.

FIG. 26 illustrates the auto-address monitor memory of the monitorarchitecture of FIG. 25.

FIG. 27 illustrates the monitor controller state machine of the monitorarchitecture of FIG. 25.

FIG. 28 illustrates the operational diagram of the monitor controllerstate machine.

FIG. 29 illustrates a monitor for monitoring an address bus.

FIG. 30 illustrates a monitor for monitoring a data bus.

FIG. 31 illustrates a monitor for monitoring either an address bus ordata bus.

FIG. 32 illustrates a monitor for monitoring single ended analogsignals.

FIG. 33 illustrates the monitor controller state machine of the analogsignal monitor of FIG. 32.

FIG. 34 illustrates a first operational diagram of the analog signalmonitor controller state machine.

FIG. 35 illustrates a second operational diagram of the analog signalmonitor controller state machine.

FIG. 36 illustrates a third operational diagram of the analog signalmonitor controller state machine.

FIG. 37 illustrates a fourth operational diagram of the analog signalmonitor controller state machine.

FIG. 38 illustrates a monitor for monitoring differential analogsignals.

FIG. 39 illustrates a single ended analog signal monitor in aninterposer.

FIG. 40 illustrates a differential analog signal monitor in aninterposer.

FIG. 41 illustrates a monitor for monitoring temperature sensors.

FIG. 42 illustrates a temperature sensor monitor in an interposer.

FIG. 43 illustrates a TAP controlled temperature sensor monitor.

FIG. 44 illustrates a TAP controlled temperature sensor monitor in aninterposer.

FIG. 45 illustrates a TAP controlled single ended analog signal monitor.

FIG. 46 illustrates a TAP controlled differential analog signal monitor.

FIG. 47 illustrates the monitor trigger unit and monitors of thedisclosure being used within a die or embedded core within a die.

FIG. 48 illustrates the instrumentation interposer of the disclosurelocated between a wire bonded stack of die and a substrate.

FIG. 49 illustrates the instrumentation interposer of the disclosurelocated between a group of one or more stacked or single die and asubstrate.

DETAILED DESCRIPTION OF THE DISCLOSURE

FIG. 14 illustrates a device 1402 comprising stacked die 1404-1408 andan interposer 1410. The die in the stack may only include functionalcircuitry that require FIO signal connections to the substrate asdescribed in FIG. 1 or they may include functional and TAP circuitrythat require FIO and TIO signal connections to the substrate asdescribed in FIGS. 2 and 5. The interposer is similar to the previouslydescribed interposers in that it provides connectivity between thestacked die and a system substrate 1412 for the FIO or FIO and TIOsignals. Interposer 1410 differs from the previously describedinterposers in that it is enhanced to include TAP and instrumentationcircuitry (TAP&INT) 1414. The interposer TAP&INT circuitry 1414 isconnected to the substrate via interposer TAP input (ITI) 1416 andinterposer TAP output (ITO) 1418 signals to allow accessing the TAP&INTcircuitry.

FIG. 15 illustrates the interposer 1410 TAP&INT circuitry 1414 in moredetail. As seen the TAP&INT circuitry 1414 includes a TAP 204 and anumber of instruments (Il-N) 1502-1504. The TAP 204 receives the ITI1416 inputs (TDI, TCK, TMS and optionally TRST) from the substrate 1412and outputs the ITO 1418 output (TDO) to the substrate. The TAP mayaccess the instruments 1-N using any of the access approaches describedin FIGS. 6-8. While any type of instrument may be implemented in theinterposer 1410, this disclosure describes non-intrusive typeinstruments that passively monitor activities and conditions occurringin the device using the interposer 1410.

FIG. 16 illustrates a device 1602 including an example interposer of thedisclosure located between stacked die 1604 and a system substrate 1412.The interposer's TAP 204 provides access, via interface 1614, to aMonitor Trigger Unit 1606, Temperature Monitors 1608, Voltage & AnalogSignal Monitors 1610 and Address & Data Bus Monitors 1612. The purposeof the Monitor Trigger Unit 1606 is to provide control, via bus 1616, toenable and operate the monitors 1608-1612. The purpose of theTemperature Monitors 1608 is to monitor temperature conditions of thedevice containing the interposer 1410. The purpose of the Voltage &Analog Signal Monitors 1610 is to monitor voltages and analog signalactivity of the device containing the interposer 1410. The purpose ofthe Address & Data Bus Monitors 1612 is to monitor digital signalactivity of address and data busses of the device containing theinterposer 1410.

FIG. 17 illustrates a device 1702 wherein the interposer 1410 of thedisclosure provides a voltage bus connection (V Bus) 1704, a ground busconnection (G Bus) 1708 and functional input and/or output (FIO) signalconnections 1706 between a substrate 1412 and stacked die 1604. The FIOconnections can transfer digital or analog signals between the substrateand stacked die. The V Bus and G Bus connections to the substrate 1412provide power and groude to the stacked die and to circuitry (TAP andinstrumentation circuitry) in the interposer 1410. Multiple V Bus and GBus connections may exist. The multiple V Bus connections may providethe same or different voltage levels.

FIG. 18 illustrates a view of how the Monitor Trigger Unit 1606 andmonitors 1608-1612 are coupled to the FIO 1706 connections and V & GBuses 1704 and 1708 existing in interposer 1410 of FIG. 17.

The Monitor Trigger Unit 1606 has inputs coupled to functional addressbus, functional data bus and functional control signals on the FIOconnections 1706 of interposer 1410. The functional control signals mayinclude functional clock signals that time functional circuitry,functional read/write signals that time memory read and/or writeoperations, or other types of functional timing signals, such as but notlimited too, oscillators and phase lock loop clock outputs. The TriggerUnit 1606 also has an input connected to an optional external trigger(XTRG) signal and inputs and an output coupled to the TDI, CTL and TDOinterface 1604 of TAP 204 of interposer 1410. The XTRG signal may comefrom the stacked die 1604, the substrate 1412 or a circuit existing inthe interposer 1410. The Monitor Trigger Unit 1606 has a monitor controlbus 1616 to control the operation of the monitors within interposer1410.

The Address & Data Bus Monitor 1612 has inputs coupled to functionaladdress and data buses on the FIO connections 1706 of interposer 1410.The Bus Monitor 1612 also has inputs and an output coupled to the TDI,CTL and TDO interface 1604 of TAP 204 of interposer 1410. The BusMonitor has inputs connected to the monitor control bus 1616 fromTrigger Unit 1606.

The Voltage & Analog Signal Monitor 1610 has inputs coupled to V bus1704, G Bus 1708 and functional analog signals on the FIO connections1706 of interposer 1410. The Voltage & Analog Signal Monitor 1610 alsohas inputs and an output coupled to the TDI, CTL and TDO interface 1604of TAP 204 of interposer 1410. The Voltage & Analog Signal Monitor hasan inputs connected to the monitor control bus 1616 from Trigger Unit1606.

The Temperature Monitor 1608 has inputs coupled to temperature sensors(TS) 1802 that may exist in the interposer 1410, in the substrate 1412or in the die stack 1604. The Temperature Monitor 1608 also has inputsand an output coupled to the TDI, CTL and TDO interface 1604 of TAP 204of interposer 1410. The Temperature Monitor has inputs connected to themonitor control bus 1616 from Trigger Unit 1606. One common type oftemperature sensor 1806 that could be used to monitor temperaturesincludes a voltage divider formed by a thermister and resistor. As thetemperature varies, the resistance of the thermister changes whichchanges the voltage output from the voltage divider. Changes in thevoltage divider output can be calibrated into temperature changes.Thermocouples and other temperature measuring circuits may also be used.

FIG. 19 illustrates monitor control bus 1616 of the monitor trigger unit1606 connected to an N number of monitors 1608-1612. The monitor controlbus consists of a clock (CLK) signal, a Start signal, monitor enablesignals (MENA1-N) and monitor input select (MISEL1-N) signals. The CLKsignal is common to all monitors 1-N and times the operation of themonitors 1-N. The Start signal is common to all monitors 1-N and startsthe operation of one or more of the monitors 1-N. The MENA1-N signalsenable the operation of one or more of the monitors 1-N. Typically, butnot necessarily, there will be one MENA signal for each monitor. TheMISEL1-N signals control the selection of inputs on one of more monitorsthat have selectable inputs.

“Plug and Play” Monitor Control Bus

The monitor control bus 1616 is “plug and play” in nature in that it canbe interfaced to any number and/or type of monitors that have inputsadapted for receiving and operating in response to the CLK, Start,MENA1-N and MISEL1-M signals provided by monitor trigger unit 1606 onmonitor control bus 1616. All that is required to extend the number ofmonitors on the monitor control bus 1616 is to provide a MENA signal foreach monitor and MISEL signals, if necessary, to each monitor coupled tothe monitor control bus 1616.

FIG. 20A illustrates an example implementation of Trigger Unit 1606. TheTrigger Unit includes an address bus comparator 2002, an addressmultiplexer 2004, a start address storage register 2006, a stop addressstorage register 2008, a data bus comparator 2010, a data multiplexer2012, a start data storage register 2014, a stop data storage register2016, a programmable trigger controller 2018 and a counter 2020, allconnected as shown.

The address bus comparator 2002 inputs an address bus from FIOconnections 1706 and compares the address to an address stored in thestart 2006 or stop 2008 address registers. The address bus comparatoroutputs an address trigger (ATRG) to the programmable trigger controllerif a match occurs between the address bus and start or stop storedaddresses. Addresses are stored in the start and stop address registersby a TDI to TDO shift operation performed by the interposer's TAP 204via interface 1604. Multiplexer 2004 is controlled by a select (SEL)signal from the programmable trigger controller to determine whether theaddress bus is compared to the stored start or stop address.

The data bus comparator 2010 inputs a data bus from FIO connections 1706and compares the data to a data stored in the start 2014 or stop 2016data registers. The data bus comparator outputs a data trigger (DTRG) tothe programmable trigger controller if a match occurs between the databus and start or stop stored data. Data are stored in the start and stopdata registers by a TDI to TDO shift operation performed by theinterposer's TAP 204 via interface 1604. Multiplexer 2012 is controlledby the SEL signal from the programmable trigger controller to determinewhether the data bus is compared to the stored start or stop data.

The programmable trigger controller 2018 inputs the ATRG signal fromcomparator 2002, DTRG signal from comparator 2010, the optional XTRGsignal, a count complete (CC) signal from counter 2020 and functionalcontrol signals from FIO connections 1706. The programmable triggercontroller outputs the CLK signal, the Start signal, the MENA1-N signalsand the MISEL1-N of control bus 1616 and a counter enable (CE) signal tocounter 2020. The programmable trigger controller is programmed by a TDIto TDO shift operation performed by the interposer's TAP 204 viainterface 1604.

The counter 2020 inputs the CE and CLK signals from the programmabletrigger controller and outputs the CC signal to the programmable triggercontroller. When enabled by CE, the counter operates for a count inresponse to the CLK signal. The count is loaded into the counter by aTDI to TDO shift operation performed by the interposer's TAP 204 viainterface 1604. When the count expires the counter outputs the CC signalto the programmable trigger controller.

The TDI and TDO signals of the start and stop address registers2006-2008, the start and stop data registers 2014-2016, the programmabletrigger controller 2018 and the counter 2020 may be separately coupledto the TDI and TDO signals of the interposers TAP 204 interface 1604 sothat each may be accessed individually. Alternatively, the TDI and TDOsignals of the start and stop address registers 2006-2008, the start andstop data registers 2014-2016, the programmable trigger controller 2018and the counter 2020 may be daisy-chained between the TDI and TDOsignals of the interposers TAP 204 interface 1604 so that they all maybe accessed together.

FIG. 20B is provided to illustrate that the XTRG input to theprogrammable trigger controller may come from a multiplexer 2022 whichinputs a Start XTRG and a Stop XTRG. The SEL output of the programmabletrigger controller controls multiplexer 2022 to select between the StartXTRG and Stop XTRG inputs as it was described selecting the Start andStop data and address inputs to multiplexers 2004 and 2012.

FIG. 21 illustrates an example implementation of programmable triggercontroller 2018. The programmable trigger controller includes triggercontroller 2102, a functional control signal multiplexer 2104 and aprogram register 2106 which is accessible by TAP interface 1614.

The trigger controller 2102 inputs the XTRG, ATRG, DTRG, and CC signals,the CLK signal output from multiplexer 2104 and programming data input2108 from program register 2106. The trigger controller 2102 outputs theSEL and Start signals of bus 1616 and the CE signal to counter 2020. Themultiplexer 2104 inputs functional control signals from FIO 1706 andsignal selection control 2112 from program register 2106. Themultiplexer 2104 selects a desired timing signal from the functionalcontrol inputs 1706 and outputs it as the CLK 2110 signal of bus 1616.The program register 2106 outputs selection control signals tomultiplexer 2104, program data input to trigger controller 2102 and theMENA1-N and MISEL1-N signals of bus 1616. The program register is loadedby a TDI to TDO shift operation from TAP interface 1614.

FIG. 22 illustrates a detailed example implementation of triggercontroller 2102 which includes a start condition multiplexer 2202, astop condition multiplexer 2204, a start stop condition multiplexer 2206and a state machine 2208.

Multiplexer 2202 has inputs for various example start conditions,including a selectable start nTRG 2210 where “n” can be a start XTRG, aselectable start ATRG or start DTRG, a selectable start nTRG “AND'ed”with a selectable start mTRG 2212 where “m” can be any start TRG otherthan the start nTRG, or any sequence of selectable start nTRG and startmTRG signals 2216 occurring separately in time. Multiplexer 2202 hascondition select (CS) inputs coupled to program register 2106 via bus2108 and a Start Condition output coupled to multiplexer 2206.

Multiplexer 2204 has inputs for various example stop conditions,including a selectable stop nTRG 2218, a selectable stop nTRG “AND'ed”or “OR'ed” with a selectable stop mTRG 2220, a count complete (CC)signal 2222 and a selectable stop nTRG and stop mTRG sequence 2224.Multiplexer 2204 has condition select (CS) inputs coupled to programregister 2106 via bus 2108 and a Stop Condition output coupled tomultiplexer 2206.

In this example, the TRG ANDing function is performed by AND gates 2226,the OR function is performed by OR gates 2228, and TRG sequences aredetected by a sequence detector (SD) state machine 2230 timed by CLKsignal 2010.

Multiplexer 2206 has inputs for the Start Condition signal frommultiplexer 2202, the Stop Condition signal from multiplexer 2204, aStart/Stop selection (SEL) signal from state machine 2208 and a startstop condition (SSC) output.

State machine 2208 has an input coupled to the SSC output of multiplexer2206, a clock input coupled to the CLK signal 2010, an enable (ENA)input coupled to program register 2104 via bus 2108 and outputs for theSEL, Start and CE signals.

FIG. 23 illustrates an example operation diagram of state machine 2208.When the ENA signal is not asserted, the state machine will be disabledin an Idle state 2302. In state 2302, the SEL signal is set forselecting the Start Condition. When the ENA signal is asserted, thestate machine transitions to state 2304 where it polls for a StartCondition from multiplexer 2206. When a Start Condition occurs, thestate machine transitions to state 2306 where it; (1) sets the Startsignal of bus 1616, (2) sets the SEL signal for selecting the StopCondition, (3) sets the CE signal to enable counter 2020 and polls for aStop Condition from multiplexer 2206. When a Stop Condition occurs, thestate machine transitions to state 2308 where it; (1) resets the Startsignal of bus 1616, (2) sets the CE signal to disable the counter 2020,(3) sets the SEL signal for selecting the Start Condition and (4) waitsfor the ENA signal to be de-asserted. When ENA is de-asserted the statemachine transitions to Idle state 2302.

The CE signal is set in state 2306 to allow the counter's CC signal tobe selected for providing the Stop Condition. For example, a monitoringoperation may be started by any of the selectable Start Conditions inputto multiplexer 2202, then, after a predetermined count, the monitoringoperation may be terminated by the CC output of counter 2020. It shouldbe understood that a further refinement of the operation diagram of 22may include optionally enabling the CE signal based upon whether thecounter 2020 is selected for providing the Stop Signal. This wouldeliminate the counter from consuming power when it is not used toprovide the Stop Condition.

As seen in FIGS. 20A-20B, setting the SEL signal for a Start Conditionin state 2302 includes setting multiplexers 2004, 2012 and if presentmultiplexer 2022 to select the start data and start address patterns tobe input to comparators 2002 and 2010 and the start XTRG to be input tothe programmable trigger controller 2018. Also as seen in FIGS. 20A-20B,setting the SEL signal for a Stop Condition in state 2306 includessetting multiplexers 2004, 2012 and if present multiplexer 2022 toselect the stop data and stop address patterns to be input tocomparators 2002 and 2010 and the stop XTRG to be input to theprogrammable trigger controller 2018.

FIG. 24 illustrates one example timing diagram depicting the operationof state machine 2208. Initially the state machine is in state 2302waiting for the ENA signal to be asserted. When the ENA signal isasserted the state machine transitions to state 2304 to poll for a StartCondition on the SSC output of multiplexer 2206. When a Start Conditionis detected the state machine transitions to state 2306 to poll for aStop Condition on the SSC output of multiplexer 2206. In state 2306 theStart, SEL and CE signals are asserted. The asserted Start signalenables a selected one or more monitors to begin a monitoring operationtimed by CLK 2110. The asserted CE signal enables the counter 2020 tobegin counting operation timed by the CLK 2110. The asserted SEL signalcontrols multiplexer 2206 to output a stop condition to the statemachine. The SEL signal also controls multiplexers 2004, 2012 and 2022to select the stop data, address or XTRG conditions. When a StopCondition is detected the state machine transitions to state 2308 towait for the ENA signal to be de-asserted. In state 2308 the Start, SELand CE signals are de-asserted. When the ENA signal is de-asserted thestate machine transitions back to the Idle state 2302.

FIG. 25 illustrates an example monitor architecture 2502 that could beused by the disclosure. The architecture includes a parallel register2504, an auto-incrementing monitor memory 2506, a serial/parallelregister 2508 and a monitor controller 2510 all connected as shown.

Register 2504 has a parallel input bus 2512, a parallel output bus 2514and a clock (CLK) input 2516.

Register 2508 has a serial bus connected to the TDI, CTL and TDO signalsof the interposer TAP interface 1614, a parallel input bus 2518 and aparallel output bus 2520.

Controller 2510 has inputs connected to the Start, CLK and a monitorenable (ME) signals of bus 1616 of programmable trigger controller 2018.Controller 2510 has an increment 1 (INC1) output, a write (WR) outputand a reset 1 (RST1) output.

Memory 2506 has a parallel data input (DI) bus coupled to the paralleldata output bus 2514 of register 2504, a parallel data output (DO) buscoupled to the parallel data input bus 2518 of register 2508. Memory2506 has a first memory address increment input coupled to the INC1output of controller 2510, a memory write input coupled to the WR outputof controller 2510, a first address reset input coupled to the RST1output of controller 2510. Memory 2506 has a memory read (RD) inputcoupled to an output of bus 2520 and a second address reset input (RST2)coupled to an output of bus 2520. Memory 2506 has a second memoryaddress increment input (INC2) coupled to an output from the CTL bus ofinterposer TAP bus 1614. In this example, and when register 2508 isselected for access by a TAP instruction that is used to read thecontents of memory 2506, the INC2 signal is asserted each time the TAPpasses through the Exist1-DR state of FIG. 4. While in this example theExit1-DR state is used to provide the INC2 signal, it should beunderstood that other appropriate TAP states could be used to providethe INC2 signal during memory read operations.

At the beginning of a memory read operation, register 2508 is accessedby the TAP interface 1614 to toggle the RST2 signal of bus 2520 and toset the RD signal of bus 2520 to place the memory in read mode. Togglingthe RST2 signal resets the memory address to a starting point from whichthe read operation will begin, typically address zero. After thisinitial setup procedure, register 2508 is accessed by the TAP to capturethe monitor data stored at the starting point address during theCapture-DR state of FIG. 4 and to shift the captured data out during theShift-DR state of FIG. 4. The TAP then transitions through the Exitl-DRstate of FIG. 4 to activate the INC2 signal to increment the memory'saddress. The TAP then transitions to Capture-DR state, via the Update-DRand Select-DR states, to capture and shift out the data stored in thenext memory address location. This capture, shift and increment addressprocess repeats until all the contents of the memory have been read.During these TAP controlled memory read operations, the RD signal of bus2520 is set to keep the memory in read mode. At the end of the readoperation, the TAP resets the RD signal.

FIG. 26 illustrate an example implementation of an auto-addressingmonitor memory 2506 that could be used in this disclosure. Theauto-addressing monitor memory consists of monitor memory 2602, anaddress counter 2604, And gate 2606 and Or gate 2608. The memory 2602has a data input (DI) for inputting parallel data 2514 from register2504, the WR input from controller 2510, the RD input from register 2508and address input from address counter 2604. The memory has a dataoutput (DO) for outputting data to the parallel input 2518 of register2508. The address counter has a RST input from And gate 2606, a CLKinput from Or gate 2608 and an address bus output to memory 2602. Andgate 2606 has an input for the RST1 signal from controller 2510, aninput for the RST2 signal from register 2508 and an output to providethe counter RST signal. Or gate 2606 has an input for the INC1 signalfrom the controller 2510, and input for the INC2 signal from the TAP CTLbus and an output to provide the counter CLK signal.

During monitor store operations, controller 2510 is enabled to providethe RST1, INC1 and WR signals to auto-addressing monitor memory 2502.During monitor read operations, the interposer's TAP accesses register2518 to provide the RST2, INC2 and RD signals to auto-addressing monitormemory 2502 to read out its stored contents.

FIG. 27 illustrates an example implementation of monitor controller 2510which consists of a state machine. The state machine has inputs forinputting the Start, CLK and MENA signals 1616 from monitor trigger unit1606 and outputs for outputting the RST1, WR and INC1 signals toauto-addressing monitor memory 2506 and the CLK signal 2516 to register2504.

FIG. 28 illustrates an example operational diagram of state machine2510. Initially the state machine will be in an Idle state 2803 waitingfor the MENA signal to be asserted. When MENA is asserted the statemachine transitions to state 2804 to output a RST1 to reset addresscounter 2604 to the starting address. From state 2804 the state machinetransitions to state 2806 where it polls for a Start signal. When theStart signal occurs, the state machine transitions to state 2808 whereit outputs a CLK signal 2516 to register 2504. In response to the CLKsignal, register 2504 stores the data present at its input 2512. Fromstate 2808 the state machine transitions to state 2810 where it outputsa WR signal to auto-addressing monitor memory 2506. In response to theWR signal, auto-addressing monitor memory 2506 stores the data that wasstored in register 2504 in response to the CLK signal of state 2808.From state 2810 the state machine transitions to state 2812 where itoutputs an INC1 signal to address counter 2604 to select the next memorylocation to be written too. If the Start signal is still asserted, thestate machine transitions back to state 2808 to repeat the CLK, WR andINC1 state operations. If the Start signal is de-asserted, the statemachine transitions to state 2806 to wait for either another Startsignal or the MENA signal to be de-asserted.

FIG. 29 illustrates a monitor 2502 wherein in the purpose is to monitorthe activity of an address bus 2902 within an interposer 1410.

FIG. 30 illustrates a monitor 2502 wherein in the purpose is to monitorthe activity of a data bus 3002 within an interposer 1410.

FIG. 31 illustrates a monitor 3102 wherein in the purpose is to monitorthe activity of either an address bus 2902 or a data bus 3002 within aninterposer 1410. Monitor 3102 differs from monitor 2502 in that itincludes a multiplexer 3104 to select the input to register toselectively come from an address bus 2902 or a data bus 3002. A MISELsignal from monitor trigger unit 1606 bus 1616 determines whether theaddress bus or data bus is selected for monitoring.

FIG. 32 illustrates a monitor 3202 wherein in the purpose is to monitorthe activity of an analog signal within an interposer 1410. The analogsignal may be any type of signal such as a time varying voltage signal,such as but not limited to, a sine wave or a fixed voltage signal suchas, but not limited to, a power supply voltage. Monitor 3202 differsfrom monitor 2502 in that it includes an analog switch (SW) 3204, ananalog to digital converter (ADC) 3206 and a monitor controller 3208adapted for controlling the ADC 3206 as described below in regard toFIGS. 33-36. Any type of ADC can be used that has an analog input andparallel digital outputs, including, but not limited to, successiveapproximation ADCs and Flash ADCs. The output of the analog switch 3204may be directly coupled to the analog input of the ADC or an amplifier(A) 3210 may exist between the analog switch output and ADC input. Ifthe amplifier in programmable, for example a programmable gainamplifier, it can receive programming (PRG) input 3212 by extending thelength of register 2508 to provide the PRG input to the amplifier viabus 2520. The programming (PRG) input may alternately come from asource, for example a TAP register, external of monitor 3202. The analogswitch receives MISEL input from bus 1616 of monitor trigger unit 1606to select one of the switch inputs (IN1-N) 3214 to be output from theswitch. The parallel digital outputs of the ADC are input to parallelinputs of monitor memory 2506.

FIG. 33 illustrates an example monitor controller 3208 which includes astate machine. The state machine differs from state machine 2510 of FIG.27 in that it includes an optional Done input from ADC 3206. Also,depending upon the type of ADC used, the operation of the CLK output tothe ADC may be different from the operation of the state machinedescribed in FIGS. 27 and 28.

FIG. 34 illustrates a first example operational diagram of state machine3208. Initially the state machine will be in an Idle state 3402 waitingfor the MENA signal to be asserted. When MENA is asserted the statemachine transitions to state 3404 to output a RST1 to reset addresscounter 2604 to the starting address. From state 3404 the state machinetransitions to state 3406 where it polls for a Start signal. When theStart signal occurs, the state machine transitions to state 3408 whereit outputs a CLK signal to ADC 3206. In response to the CLK signal, ADC3206 samples its analog input, digitizes the sampled signal and outputsa parallel digital representation of the analog signal to the parallelinputs of memory 2506. The ADC in this example is assumed to have a highspeed internal clock that is enabled by the CLK signal to convert thesampled analog input into the parallel digital output. The analog todigital conversion is fast enough to occur before the WR signal isasserted in state 3410. From state 3408 the state machine transitions tostate 3410 where it outputs a WR signal to auto-addressing monitormemory 2506. In response to the WR signal, auto-addressing monitormemory stores the parallel outputs of ADC 3206. From state 3410 thestate machine transitions to state 3412 where it outputs an INC1 signalto address counter 2604 to select the next memory location to be writtentoo. If the Start signal is still asserted, the state machinetransitions back to state 3408 to repeat the CLK, WR and INC1 stateoperations. If the Start signal is de-asserted, the state machinetransitions to state 3406 to wait for either another Start signal or theMENA signal to be de-asserted.

FIG. 35 illustrates a second example operational diagram of statemachine 3208. Initially the state machine will be in an Idle state 3502waiting for the MENA signal to be asserted. When MENA is asserted thestate machine transitions to state 3504 to output a RST1 to resetaddress counter 2604 to the starting address. From state 3504 the statemachine transitions to state 3506 where it polls for a Start signal.When the Start signal occurs, the state machine transitions to state3508 where it outputs a number (N) of CLK signals to ADC 3206. Inresponse to the CLK signals, ADC 3206 samples its analog input,digitizes the sampled signal and outputs a parallel digitalrepresentation of the analog signal to the parallel inputs of memory2506. The ADC in this example is assumed to operate in response to the NCLK signals of state 3508 to convert the sampled analog input into theparallel digital output. From state 3508 the state machine transitionsto state 3510 where it outputs a WR signal to auto-addressing monitormemory 2506. In response to the WR signal, auto-addressing monitormemory stores the parallel outputs of ADC 3206. From state 3510 thestate machine transitions to state 3512 where it outputs an INC1 signalto address counter 2604 to select the next memory location to be writtentoo. If the Start signal is still asserted, the state machinetransitions back to state 3508 to repeat the CLK, WR and INC1 stateoperations. If the Start signal is de-asserted, the state machinetransitions to state 3506 to wait for either another Start signal or theMENA signal to be de-asserted.

FIG. 36 illustrates a third example operational diagram of state machine3208. Initially the state machine will be in an Idle state 3602 waitingfor the MENA signal to be asserted. When MENA is asserted the statemachine transitions to state 3604 to output a RST1 to reset addresscounter 2604 to the starting address. From state 3604 the state machinetransitions to state 3606 where it polls for a Start signal. When theStart signal occurs, the state machine transitions to state 3608 whereit outputs a CLK signal to ADC 3206 and polls for a Done signal from theADC 3206. In response to the CLK signal, ADC 3206 samples its analoginput, digitizes the sampled signal, outputs a parallel digitalrepresentation of the analog signal to the parallel inputs of memory2506 then outputs the Done signal to the state machine 3208. The ADC inthis example is assumed to have an internal clock that is enabled by theCLK signal to convert the sampled analog input into the parallel digitaloutput. The analog to digital conversion of this example is not fastenough to occur before the WR signal is asserted in state 3610,therefore the state machine must remain in state 3608 until the Donesignal is asserted. In state 3610 the state machine outputs a WR signalto auto-addressing monitor memory 2506. In response to the WR signal,auto-addressing monitor memory stores the parallel outputs of ADC 3206.From state 3610 the state machine transitions to state 3612 where itoutputs an INC1 signal to address counter 2604 to select the next memorylocation to be written too. If the Start signal is still asserted, thestate machine transitions back to state 3608 to repeat the CLK, WR andINC1 state operations. If the Start signal is de-asserted, the statemachine transitions to state 3606 to wait for either another Startsignal or the MENA signal to be de-asserted.

FIG. 37 illustrates a fourth example operational diagram of statemachine 3208. Initially the state machine will be in an Idle state 3702waiting for the MENA signal to be asserted. When MENA is asserted thestate machine transitions to state 3704 to output a RST1 to resetaddress counter 2604 to the starting address. From state 3704 the statemachine transitions to state 3706 where it polls for a Start signal.When the Start signal occurs, the state machine transitions to state3708 where it outputs CLK signals to ADC 3206 and polls for a Donesignal from the ADC 3206. In response to the CLK signals, ADC 3206samples its analog input, digitizes the sampled signal, outputs aparallel digital representation of the analog signal to the parallelinputs of memory 2506 then outputs the Done signal to the state machine3208. The ADC in this example is assumed to operate in response to theCLK signals output during state 3708 to convert the sampled analog inputinto the parallel digital output. When the analog to digital conversionis complete the Done signal is asserted and the state machinetransitions to state 3710. In state 3710 the CLK outputs are stopped anda WR signal is output to memory 2506. In response to the WR signal,auto-addressing monitor memory stores the parallel outputs of ADC 3206.From state 3710 the state machine transitions to state 3712 where itoutputs an INC1 signal to address counter 2604 to select the next memorylocation to be written too. If the Start signal is still asserted, thestate machine transitions back to state 3708 to repeat the CLK, WR andINC1 state operations. If the Start signal is de-asserted, the statemachine transitions to state 3706 to wait for either another Startsignal or the MENA signal to be de-asserted.

FIG. 38 illustrates a monitor 3802 wherein in the purpose is tosimultaneously monitor the activity of a pair of analog signals withinan interposer 1410. The analog signals may be any type of signals suchas time varying voltage signals such as, but not limited to, sine wavesignals or fixed voltage signals such as, but not limited to, powersupply and/or ground voltages. Monitor 3802 differs from monitor 3202 inthat it includes two analog switches (SW) 3204, two analog to digitalconverters (ADC) 3206 and a monitor memory 3804 having dual parallelinput ports 3214, one for each parallel output of the ADCs. Any types ofpreviously described ADCs may be used. The outputs of the analogswitches 3204 may be directly coupled to the analog inputs of the ADCsor amplifiers may exist between the analog switch outputs and ADCinputs. If the amplifiers are programmable they can receive programminginput as described in FIG. 32. The analog switches receive MISEL inputfrom bus 1616 to select one of their switch inputs 3214 to be output tothe ADCs. The parallel digital outputs of the ADCs are input to parallelinputs of the dual input ports of monitor memory 3804. The monitorcontroller 3208 can operate the ADCs as described in FIGS. 34-37. Thistype of analog monitor is used when it is desired to monitordifferential analog voltages.

FIG. 39 illustrates a stacked die 3902 mounted on an interposer 3904which is mounted on a substrate 3906. The interposer provides a voltagebus (VB) 3908, ground bus (GB) 3910 and functional interconnects,including analog signal (AS) interconnects 3912 and 3914 between thestacked die and substrate. The interposer includes the single endedanalog signal monitor 3202 of FIG. 32. The inputs 3214 of analog monitor3202 are connected to the VB 3908, GB 3910, AS 3912 and AS 3914. Whenenabled by monitor trigger unit 1606, monitor 3202 operates to sample,digitize and store the voltage levels occurring in time on a selectedinput, i.e. VB, GB or AS. When the monitoring operation ends, the storeddigital representations of the sampled voltages can be shifted out ofthe monitor memory for examination, via the interposer TAP 204.

The single ended analog signal monitoring of FIG. 39 can be triggered tostart and stop during selected functional start and stop conditionsdetected by the monitor trigger unit 1606. For example, a single endedmonitoring of the voltage on the VB or GB connection can be triggered tooccur over a functional stacked die operation defined by a start andstop condition or a single ended monitoring a voltage on a selected ASconnection can be triggered to occur over a functional stacked dieoperation defined by a start and stop condition. Monitoring the VB or GBconnection allows testing that the voltages on the VB or GB remain atacceptable levels during power intensive functional operations of thestacked die. Monitoring an AS connection allows testing that the analogvoltage signals on the connection are operating properly and withinspecification during a functional operation of the stacked die.

FIG. 40 illustrates a stacked die 3902 mounted on an interposer 4002which is mounted on a substrate 3906. The interposer provides a voltagebus (VB) 3908, ground bus (GB) 3910 and functional interconnects,including analog signal (AS) interconnects 3912 and 3914. The interposerincludes the differential analog signal monitor 3802 of FIG. 38. Firstselectable inputs 3214 of analog monitor 3802 are connected to the VB3908 at contact point 4004, GB 3910 at contact point 4008 and AS 3912.Second selectable inputs 3214 of analog monitor 3802 are connected tothe VB 3908 at contact point 4006, GB 3910 at contract point 4010 and AS3914. Contact point 4004 is the VB connection in close proximity tostacked die 3902 and contact point 4006 is the VB connection in closeproximity to substrate 3906. Contact point 4008 is the GB connection inclose proximity to stacked die 3902 and contact point 4010 is the GBconnection in close proximity to substrate 3906. When enabled by monitortrigger unit 1606, monitor 3802 operates to sample, digitize and storedifferential voltage levels selected on the first and second inputs3214. The VB voltage levels at contact points 4004 and 4006 may beselected to allow monitoring the voltage differences occurring in timebetween points 4004 and 4006 to determine the voltage drop on the VBbussing path 3908. The GB voltage levels at contact points 4008 and 4010may be selected to allow monitoring the voltage differences occurring intime between points 4008 and 4010 to determine the voltage drop on theGB bussing path 3910. AS 3912 and AS 3914 may selected to allowmonitoring the voltage differences occurring in time between AS 3912 andAS 3914. When the differential monitoring operation ends, the storeddigital representations of the sampled differential voltages can beshifted out of the monitors memory for examination, via the interposerTAP 204.

The differential analog signal monitoring of FIG. 40 can be triggered tostart and stop during selected functional start and stop conditionsdetected by the monitor trigger unit 1606. For example, a differentialmonitoring of the voltage drop across the VB or GB connection can betriggered to occur over a functional stacked die operation defined by astart and stop condition or a differential monitoring of the voltagesoccurring on two selected AS connections can be triggered to occur overa functional stacked die operation defined by a start and stopcondition. Differentially monitoring the voltage drops across the VB orGB connection allows testing that the voltage drops remain withinacceptable levels during power intensive functional operations of thestacked die. Further, by knowing the resistance of the VB and GBconnections, the supply and ground currents through the connections maybe determined by Ohm's Law. By knowing the current through and thevoltage drop across a VB or GB, power monitoring can be performed duringa selected functional operation of the die stack. Differentiallymonitoring the voltages on two AS connections allows testing that theanalog signals are operating properly and within specification during afunctional operation of the stacked die.

FIG. 41 illustrates a monitor 4102 wherein in the purpose is to monitortemperature sensor (TS) outputs 4110. The outputs may come from any typeof TS such as those mentioned in regard to FIG. 18. Monitor 4102 is thesame as monitor 3202 with the exception that it includes a counter 4106and a modified auto-addressing monitor memory 4104. The counter 4106 hasinputs for the RST1 and INC1 signals from controller 3208 andtemperature sensor address (TSA) outputs. The TSA outputs are input toanalog switch (SW) 3204 in substitution of the MISEL inputs of FIG. 32.Each TSA count pattern controls SW 3204 to select one of the TS outputsto be input to the ADC 3206. The TSA count patterns are also input toadditional inputs provided on monitor memory 4104 to allow identifyingwhich TS is currently being selected for a temperature measurement. Whenenabled, the monitor controller state machine 3208 operates to controlthe ADC 3208 and monitor memory 4104 as previously described. Themonitor controller state machine 3208 also controls counter 4106 usingthe RST1 and INC1 signals. Depending on the type of ADC being used, themonitor controller state machine operates according to one of theoperational diagrams of FIGS. 34-37. The operation of temperature sensormonitor 4102 is described below using the operational state diagram ofFIG. 34 as one example.

As seen in the operational diagram of FIG. 34, state machine 3208 willinitially be in an Idle state 3402 waiting for the MENA signal to beasserted. When MENA is asserted the state machine transitions to state3404 to output a RST1 signal to reset the address counter 2604 ofmonitor memory 4104 and counter 4106 to starting addresses. From state3404 the state machine transitions to state 3406 where it polls for aStart signal. When the Start signal occurs, the state machinetransitions to state 3408 where it outputs a CLK signal to ADC 3206. Inresponse to the CLK signal, ADC 3206 samples the analog output of thecurrently addressed TS, digitizes the sampled signal and outputs aparallel digital representation of the analog signal to the parallelinputs of memory 4104. From state 3408 the state machine transitions tostate 3410 where it outputs a WR signal to monitor memory 4104. Inresponse to the WR signal, monitor memory 4104 stores the paralleloutputs of ADC 3206 and the current TSA output from the counter 4106.From state 3410 the state machine transitions to state 3412 where itoutputs an INC1 signal to address counter 2604 of the monitor memory4104 to select the next memory location to be written too and to counter4106 to increment the TSA counter 4106 to the next count pattern toselect the next TS to be measured. If the Start signal is stillasserted, the state machine transitions back to state 3408 to repeat theCLK, WR and INC1 state operations. When the TSA counter 4106 reaches amaximum count it wraps around to the starting count and continuescounting. If the Start signal is de-asserted, the state machinetransitions to state 3406 to wait for either another Start signal or theMENA signal to be de-asserted.

At the end of a monitoring operation, register 2508 is accessed by theinterposer TAP, via bus 1614, to read out the contents of the monitormemory locations. Each location read will contain data from a TSmeasurement and the address (the TSA output of counter 4106) of the TSthat was measured.

FIG. 42 illustrates a stacked die 4202 mounted on an interposer 4204which is mounted on a substrate 4206. The interposer 4204 contains atemperature monitor 4102 with inputs coupled to temperature sensors(TS). As seen the TS's can exist in the interposer, the substrate,and/or in die of the die stack. When enabled and a start conditionoccurs, the temperature monitor cycles through the steps of addressingeach TS and sampling, digitizing and storing its output. This operationcontinues until the start condition goes away. At the end of atemperature monitoring operation, the stored TS temperature measurementsand TS addresses of each are read out of temperature monitor 4102 by theinterposer TAP 204 for examination.

FIG. 43 illustrates an example of a TAP controlled temperature monitor4302 that includes a SW 3204, an ADC 3206, optional amplifier (A) 3210and a TAP controlled register 4304. Temperature monitor 4302 differsfrom the temperature monitor 4102 in that the interposer TAP controlsthe operation of monitor 4302 instead the trigger unit 1606. SW 3204 hasTS inputs 4110, select temperature sensor (SELTS) inputs for selecting aTS for measurement and an output coupled to an input of the ADC.Register 4304 has SELTS outputs coupled to the SELTS inputs of SW 3204,a CLK output coupled to the ADC, an optional Done input from the ADC andinputs for inputting the data output (DO) from the ADC. Register 4304 iscoupled to the TDI, CTL and TDO signals of bus 1614 to allow the TAP toaccess register 4304 to control the operation of temperature monitor4302.

To obtain a temperature measurement from one of the TS 1-N, the TAPperforms one or more scan operations to register 4304 to shift in andupdate data on the SELTS outputs to select a TS1-N for measurement andto enable a CLK to be output from register 4304 to start themeasurement. The CLK output from register 4304 needs to occur after theSELTS signals have been set to select a TS for measurement. This can beachieved in different ways, including, but not limited to, the followingtwo ways. A first way is to perform a first scan operation of register4304 to update the SELTS outputs to select a TS for measurement,followed by a second scan operation of register 4304 to assert the CLKoutput to start the measurement process. A second way is to do a singlescan operation to register 4304 that updates the SELTS outputs to selecta TS for measurement and also asserts the CLK output to start themeasurement process. In the second way, register 4304 must be adaptedwith circuitry that delays the assertion of the CLK output until afterthe SELTS outputs have set to select a TS1-N for measurement.

In this example, the ADC 3206 is assumed to be self timed (i.e. it hasan internal clock/oscillator) after receiving the CLK input from theregister. The ADC may or may not include a Done output signal. If itincludes a Done output signal, the TAP will repeatedly scan the registerto capture and shift out the value of the Done signal and the DO fromthe ADC. When the Done signal is asserted, the DO values scanned outwill be the TS measurement data. If the ADC does not require a Donesignal, i.e. the self timed ADC operation is fast enough to occur wellbefore the next TAP scan operation to register 4304, the DO valuecaptured and shifted out on the next scan operation will be the TSmeasurement data.

FIG. 44 illustrates a stacked die 4402 mounted on an interposer 4404which is mounted on a substrate 4406. The interposer 4404 contains atemperature monitor 4302 with inputs coupled to temperature sensors(TS). As seen the TS's can exist in the interposer, the substrate,and/or in die of the die stack. When controlled by the interposer TAP,the temperature monitor 4302 can address one of the TS inputs andsample, digitize and shift out the temperature measurement from the TS.The advantage of the temperature monitor 4303 over temperature monitor4102 is simplicity. The disadvantage is that the temperature monitoringcannot be synchronized to occur in response to a specific functionaloperation of stacked die 4402, as can the temperature sensor 4102 ofFIG. 41.

While the monitor trigger unit 1606 and monitors 1608-1612 of thedisclosure have been described as being used within interposers, itshould be understood that the monitor trigger unit 1606 and monitors1608-1612 could be used within a die or within an embedded core locatedwithin a die.

FIG. 45 illustrates a singled ended TAP controlled analog signal monitor4502 that can be used to sample, digitize and output analog signals.Monitor 4502 is the same as monitor 4302 with the exception that SW 3204is coupled to analog signal inputs (IN-1-) 3214 instead of totemperature sensor outputs. Monitor 4502 can be used in substitution ofthe trigger unit controlled monitor 3202 of FIG. 39 to measure singleended voltages on interposer VB, GB and AS signals.

FIG. 46 illustrates a differential TAP controlled analog signal monitor4602 that can be used to sample, digitize and output differential analogsignals. Monitor 4602 is the same as monitor 4502 with the exceptionthat it includes two switches (SW) 3204 each having inputs (IN1-N) 3214for inputting analog signals, two ADCs 3206 and a register havingparallel inputs for the data outputs (DO) of both ADCs. Monitor 4602 canbe used in substitution of the trigger unit controlled monitor 3802 ofFIG. 40 to measure differential voltages on interposer VB, GB and ASsignals.

While the monitor trigger unit 1616, trigger controlled monitors1608-1612 and TAP controlled monitors 4302, 4502 and 4602 have beendescribed being used within interposers, it should be understood thatthey are not limited to only being used within interposers. As describedin FIG. 47 below, they can also be used within die or embedded coreswithin die.

FIG. 47 illustrates a die or embedded core 4702 which includes themonitor trigger unit 1606, address & data bus monitors 1612, voltage &analog signal monitors 1610, 4502 and 4602 and temperature monitors 1608and 4302. The monitor trigger unit and monitors operate in the die orembedded core 4702 as they have been described operating in interposers.The monitor trigger unit and monitors are coupled to a TAP 204 withinthe die or embedded core 4702 via bus 1614. The TAP is interfaced toexternal TDI, TCK, TMS and TDO signals on the die or embedded core 4702.The monitor trigger unit is coupled to an address bus, a data bus andcontrol signals located within the die or embedded core 4702. Also,monitor trigger unit may be interface to an external XTRG signal 4706 ofthe die or embedded core 4702. Monitor 1612 is coupled to an address busand a data bus located within the die or embedded core 4702. Monitors1610, 4502 and/or 4602 are coupled to a V Bus, a G Bus and analogsignals located within the die or embedded core 4702. Monitors 1608and/or 4302 are coupled to temperature sensors (TS) located within thedie or embedded core 4702. Trigger unit controlled monitors operate inresponse to the monitor control bus 1616 as has been described. TAPcontrolled monitors operate in response to TAP control as has beendescribed.

FIG. 48 illustrates the use of an instrumentation interposer of thedisclosure being used with a stack of die 4804-4808 that are connectedto the interposer via bond wires. The instrumentation interposeroperates as previously described to access and control monitoringinstruments within the interposer.

FIG. 49 illustrates a group of one or more stacked or single die4904-4908 located on an instrumentation interposer 4902 of thedisclosure. The instrumentation interposer operates as previouslydescribed to access and control monitoring instruments within theinterposer.

Although the disclosure has been described in detail, it should beunderstood that various changes, substitutions and alterations may bemade without departing from the spirit and scope of the disclosure asdefined by the appended claims.

What is claimed is:
 1. An interposer comprising: (a) a test access porthaving a test data input lead, a test data output lead, a test clocklead, a test mode select lead, and test control leads; (b) functionalcircuitry leads; (c) monitor trigger circuitry having inputs coupled tothe functional circuitry leads, the test data input lead, and the testcontrol leads, and having an output coupled to the test data outputlead, and monitor control outputs; and (d) temperature monitor circuitryhaving an input adapted to be coupled to a temperature sensor, having aninput coupled to the monitor control outputs, an input coupled to thetest data input lead, an input coupled to the test control leads, and anoutput coupled to the test data output lead.
 2. The interposer of claim1 in which the test access port includes state machine circuitry havinginputs coupled with the test clock lead and the test mode select lead,and having state outputs coupled with the test control leads.
 3. Theinterposer of claim 1 including a silicon substrate having top andbottom surfaces and in which the functional circuitry leads includethrough silicon vias coupling leads on the top and bottom surfaces ofthe substrate.
 4. The interposer of claim 1 including a siliconsubstrate having top and bottom surfaces and in which the test datainput lead, the test data output lead, the test clock lead, and the testmode select lead include through silicon vias coupling leads on the topand bottom surfaces of the substrate.
 5. The interposer of claim 1including a silicon substrate having top and bottom surfaces and inwhich the functional circuitry leads include through silicon viascoupling leads on the top and bottom surfaces of the substrate and inwhich the test data input lead, the test data output lead, the testclock lead, and the test mode select lead include through silicon viascoupling leads on the top and bottom surfaces of the substrate.
 6. Theinterposer of claim 1 including a temperature sensor in the interposerand coupled to the temperature monitor circuitry.